Allegro manufacturing：

2-40 layers board, metal substrate, high Tg thick copper plate, Rigid-flex PCB, HDI boards, embedded board, high-frequency mixed plate, high-precision impedance board, the fastest sample processing cycle: double sided board will be competed within 24 hours ,4 - 10 layers board will be delivered within 48 hours , It can provide customers with faster service, shortening development cycles and seizing market opportunities.

Production capacity:

Excellent and fast delivery capability: double express will be shipped within 24 hours, multi-express in 2-4 days;

scale advantages of model of small quantities: delivery capacity reaches to more than 10,000 varieties;    

Reached the world advanced level of equipment capacity: producing high-level back, HDI boards, high-frequency boards, high TG boards, halogen-free boards, flexible and Rigid-flex PCB and other high-tech products

Process capability of Rigid board 

Layers: 1-40

Minimum Line Width /Spacing: 2.5mil

Maximum Aspect Ratio: 22:1

Minimum Mechanical Drill Hole: 4mil

Surface Treatment:  HASL, chemistry immersion gold, chemical nickel palladium, immersion tin, immersion silver, gold-plated full-board, organic coating process, lead-free HASL, hard gold plated, soft gold plated , gold finger, etc.

Thickness: 0.005 "~ 0.276" (0.13mm ~ 7.0mm)

Material: FR-4, high TG, halogen-free, high-frequency (Rogers, Arlon \ Taconic, Nalco, Taxiing microwave F4B, Isola ...)and so on

Maximum Board Size: 23 "* 35" (584mm * 889mm)

Process capability of rigid-flex board

Capacity of mass-scale production of Rigid-flex board with high-density

Max Layer: 20

Min line width/space: 3.5/3.5mil

Aspect Ratio: 10:1

Hole Diameter: 8mil

Max Size: 20 * 24inch

Surface Treatment: HASL, Immersion gold, Immersion Tin, Immersion Silver, organic coating process, lead-free HASL, gold plated hardware, soft gold, silver and other impedance control technology HDI technology

Ability of the metal substrate technology

Layers: 1-12L (metal substrate& metal core board) ,2-24L (buried / embedded metal plate & cold plate & sinter plate) ,1-2L (ceramic DBC board) Thickness :0.5-7 .0 mm

Dimensions: max: 610 * 610, min: 5 * 5mm

Mechanical Processing: X / Y / Z accuracy ± 0.03mm, speaker holes, screw hole

Thermal conductive materials coefficient of thermal conductivity: 1-170W / mk(including AL2O3)

Metal Surface Treatment: Aluminum ordinary oxidation, Aluminum hard anode oxidation, aluminum chemical passivation, sandblasting, wire drawing,surface finishing treatment

Surface Treatment: HASL,Chemistry sink gold,Chemical nickel palladium, immersion tin, immersion silver, gold-plated full board, soft/hard gold plating ,organic coating processing

Type: pre-bonding、postbonding 、sntering process, metal sandwich, cooling-plate, ceramic DBC board