Allegro manufacturing

2-40 layers board, metal substrate, high Tg thick copper plate, Rigid-flex PCB, HDI boards, embedded board, high-frequency mixed plate, high-precision impedance board, etc.

The fastest sample processing cycle: Double sided board can be completed within 24 hours ,4 - 10 layers board can be delivered within 48-96 hours. We can provide customers with faster service, shortening development cycles and seizing market opportunities.

Production capacity

Excellent and fast delivery capability: Express double sided board can be shipped within 24 hours, express multi-layers board can be finished in 2-4 days.

Scale advantages of model of small quantities: Delivery capacity reaches to more than 10,000 varieties.    

Reached the world advanced level of equipment capacity: Producing high-level backplane, HDI boards, High-frequency boards, High TG boards, Halogen-free boards, Flexible and Rigid-flex PCB and other high-tech products.

Process capability of Rigid board 

Layers: 1-40

Minimum Line Width /Spacing: 2.5mil

Maximum Aspect Ratio: 22:1

Minimum Mechanical Drill Hole: 4mil

Surface Treatment:  HASL, Chemistry Immersion gold, Chemical nickel palladium, Immersion tin, Immersion silver, Gold-plated full-board, Organic coating process, Lead-free HASL, Hard gold plated, Soft gold plated , Gold finger, etc.

Thickness: 0.005 "~ 0.276" (0.13mm ~ 7.0mm)

Material: FR-4, high TG, Halogen-free, High-frequency (Rogers, Arlon \ Taconic, Nelco, Taxiing microwave F4B, Isola ...) and so on

Maximum Board Size: 23 "* 35" (584mm * 889mm)

Process capability of rigid-flex board

Capacity of mass-scale production of Rigid-flex board with high-density

Max Layer: 20

Min line width/space: 3.5/3.5mil

Aspect Ratio: 10:1

Hole Diameter: 8mil

Max Size: 20 * 24inch

Surface Treatment: HASL, Immersion gold, Immersion Tin, Immersion Silver, Organic coating process, Lead-free HASL, Gold plated hardware, Soft gold, Silver and other impedance control technology, HDI technology.

Ability of the metal substrate technology

Layers: 1-12L (metal substrate& metal core board), 2-24L (buried / embedded metal plate & cold plate & sinter plate) ,1-2L (ceramic DBC board)

Thickness: 0.5 - 7.0 mm

Dimensions: max 610 * 610mm, min 5 * 5mm

Mechanical Processing: X / Y / Z accuracy ± 0.03mm, speaker holes, screw hole.

Thermal conductive materials coefficient of thermal conductivity: 1-170W / mk(including AL2O3).

Metal Surface Treatment: Aluminum ordinary oxidation, Aluminum hard anode oxidation, Aluminum chemical passivation, Sandblasting, Wire drawing, surface finishing treatment.

Surface Treatment: HASL, Chemistry sink gold, Chemical nickel palladium, Immersion tin, Immersion silver, Gold-plated full board, Soft/hard gold plating ,Organic coating processing.

Type: Pre-bonding, Postbonding, Sntering process, Metal sandwich, Cooling-plate, Ceramic DBC board.